傑出產品獎｜先進設備及智慧製造類 | 均豪精密工業股份有限公司 | 次世代顯示器矩陣式膜材貼附機

得獎技術簡介

• 使用SHEET TYPE貼合技術：是以片狀（sheet）形式的黏著膜，透過貼合設備將其貼在基材上的一種製程方式。
• 採用無張力貼合光學膠膜設計技術，可避免中繼膜材貼合過程出現微小應力，在定位精度及製程穩定度相對高。
• 目前設備擁有技術自主能力與自主專利，已有客戶群使用且試量產中，伴隨著客戶製程需求與設備經驗，開發許多階段性的功能。

 

得獎技術創新特色

• 適用尺寸: G4.5(730*920mm)
  • 載板Carrier:玻璃基板
  • 中繼膜材:暫時光學膠
• 無張力貼合技術,不易產生拉伸,氣泡
• 高效能視覺對位,貼合精度高
• 一對多矩陣式貼合,快速對應尺寸與材料多樣性
• 上游銜接入出料設備，自動化生產

 

得獎技術應用

Micro LED巨量轉移製程的中繼暫存板光學膜材貼合

• 在 Micro LED 顯示製程中，巨量轉移（Mass Transfer）晶粒轉移前，通常會在Carrier先貼上一層中繼光學黏性膜材（Intermediate Optical Film）。
• 暫存板可黏晶，提高精準度、提升良率；減少晶粒損害，輕易以雷射解黏達到晶粒移轉目的。

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Gold Panel Awards - Advanced Equipment/Smart Manufacturing

Company Name：Gallant Precision Machining Co Ltd

Technology/Product Name：Next-Gen Display Matrix Film Lamination Equipment

 

Technology/Product Features

• Sheet-type lamination technology: This process involves attaching a sheet-like adhesive film to a substrate using lamination equipment.
• Employing tension-free optical adhesive film design technology avoids minor stresses during the intermediate film lamination process, resulting in relatively high positioning accuracy and process stability.
• Currently, the equipment possesses independent technological capabilities and patents. It is already in use by a customer base and is undergoing trial production. As customer process requirements and equipment experience evolves, many phased functionalities have been developed.

Innovation

• Applicable Size: G4.5 (730*920mm)
  • Carrier: Glass substrate
  • Intermediate Film: Temporary optical adhesive
• Tension-free Lamination technology, less prone to stretching and air bubbles.
• High-efficiency visual alignment, high lamination accuracy.
• Matrix lamination Module quickly adapts to diverse sizes and materials.
• Upstream-connected inlet and outlet allow for full-auto production.

Applications

In the Micro LED mass transfer process, intermediate optical film is bonded to the carrier.

• In the Micro LED display process, before mass transfer of the chips, an intermediate optical film is typically bonded to the carrier.
• The carrier can bond chips, improving accuracy and yield; reducing chip damage; and easily achieving chip transfer through laser debonding.